Cooling Plate (Square)
The copper cooling plate is a specially engineered thermal component designed for applications with extremely high heat loads. Constructed from two high-thermal-conductivity copper plates joined by high-temperature vacuum brazing, it provides a vacuum-tight and distortion-free solution. Precisely integrated cooling channel structures enable efficient dissipation of surface heat fluxes up to 2 MW/m².
With a flatness of 0.08 mm over an area of approximately 400 x 400 mm and excellent surface finish, the plate is ideal for high-performance applications in power electronics, laser systems, and semiconductor manufacturing.
Cooling of high-power semiconductors in converters, inverters, and drive systems.
Thermal management in high-power lasers and laser cutting systems.
Cooling in process machines such as lithography systems or chemical-mechanical polishing (CMP) equipment.
Precise thermal management in experimental setups.
Thermal regulation of systems with high power density.
The square copper cooling plate provides a technologically advanced solution for applications with extreme thermal loads. With precise cooling channel structures, high-temperature vacuum brazing, and highest manufacturing accuracy, it ensures thermal efficiency, corrosion resistance, and leak tightness. Its versatility makes it indispensable for power electronics, laser technology, and semiconductor manufacturing.
REUTER TECHNOLOGIE GmbH
Röntgenstraße 1 - D-63755 Alzenau
